TC1-200G
Chip Quik, Inc.
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionHEAT SINK COMPOUND - HIGH DENSIT
- CategoryThermal - Adhesives, Epoxies, Greases, Pastes
-
ECAD Model
- Share
In Stock: 195
Can ship immediately
Pricing:
- 1$49.95
Quote It
Technical Details
- Series:-
- Package:Bulk
- Part Status:Active
- Type:Silicone Compound
- Size / Dimension:200 gram Jar
- Usable Temperature Range:-
- Color:White
- Thermal Conductivity:0.67W/m-K
- Features:-
- Shelf Life:60 Months
- Storage/Refrigeration Temperature:37°F ~ 77°F (3°C ~ 25°C)
Related Products
NON- SILICONE HEAT SINK COMPOUND
- 1: $14.00000
SILICONE HEAT SINK COMPOUND 2507
- 1: $14.00000
EPOXY MOLD RELEASE (NON SILICONE
- 1: $21.05000
THERM-A-GAP GEL 37 3.7 W/M-K DIS
- 1: $26.95000
THERM-A-GAP GEL 37 3.7 W/M-K DIS
- 1: $34.15000
HEAT SINK COMPOUND WHT 142G TUBE
- 1: $37.58000
NON-SILICONE THERMAL PUTTY 30CC
- 1: $41.46000
THERM-A-GAP GEL 75 7.5 W/M-K DIS
- 1: $47.34000
THERMAL ADHESIVE GRAY 25ML KIT
- 1: $60.82000
THERM-A-GAP GEL 75 7.5 W/M-K DIS
- 1: $95.97000