• Lifecycle status Active
  • RoHS RoHS Compliant
  • Description63S4 WS200 ACP 500G JAR
  • CategorySolder
  • Datasheet 1354298 Datasheet
  • ECAD Model
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In Stock: 194

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Technical Details

  • Series:WS200™
  • Package:Bulk
  • Part Status:Obsolete
  • Type:Solder Paste
  • Composition:Sn63Pb37 (63/37)
  • Diameter:-
  • Melting Point:361°F (183°C)

 

  • Flux Type:Water Soluble
  • Wire Gauge:-
  • Process:Leaded
  • Form:Jar, 17.64 oz (500g)
  • Shelf Life:6 Months
  • Shelf Life Start:Date of Manufacture
  • Storage/Refrigeration Temperature:32°F ~ 50°F (0°C ~ 10°C)

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