A2F060M3E-1FGG256M

Microsemi
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Technical Details

  • Series:SmartFusion®
  • Package:Tray
  • Part Status:Obsolete
  • Architecture:MCU, FPGA
  • Core Processor:ARM® Cortex®-M3
  • Flash Size:128KB
  • RAM Size:16KB

 

  • Peripherals:DMA, POR, WDT
  • Connectivity:EBI/EMI, I²C, SPI, UART/USART
  • Speed:100MHz
  • Primary Attributes:ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
  • Operating Temperature:-55°C ~ 125°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)

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