69-11-42342-T777

Parker Chomerics
In Stock: 249

Can ship immediately

Pricing:
  • 1$20.45
  • 10$19.31389
  • 25$18.17778
  • 50$17.04167
  • 100$15.90556
  • 250$14.76944
  • 500$14.48543

Quote It

Technical Details

  • Series:THERMFLOW® T777
  • Package:Bulk
  • Part Status:Active
  • Usage:-
  • Type:Gap Filler Pad, Sheet
  • Shape:Square
  • Outline:152.40mm x 152.40mm

 

  • Thickness:0.0045" (0.115mm)
  • Material:Polymer Solder Hybrid
  • Adhesive:Tacky - Both Sides
  • Backing, Carrier:-
  • Color:Gray
  • Thermal Resistivity:-
  • Thermal Conductivity:-

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