60-1518-10
Aries Electronics, Inc.- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 60POS GOLD
- CategorySockets for ICs, Transistors
- Datasheet 60-1518-10 Datasheet
-
ECAD Model
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In Stock: 107
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Technical Details
- Series:518
- Package:Bulk
- Part Status:Obsolete
- Type:DIP, 0.2" (5.08mm) Row Spacing
- Number of Positions or Pins (Grid):60 (2 x 30)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:10.0µin (0.25µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Open Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin
- Contact Finish Thickness - Post:200.0µin (5.08µm)
- Contact Material - Post:Brass
- Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
- Operating Temperature:-
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