SIP1X06-014BLF
Storage & Server IO (Amphenol ICC)
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN SOCKET SIP 6POS TIN
- CategorySockets for ICs, Transistors
- Datasheet SIP1X06-014BLF Datasheet
-
ECAD Model
- Share
In Stock: 169
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Pricing:
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Technical Details
- Series:SIP1x
- Package:Bulk
- Part Status:Obsolete
- Type:SIP
- Number of Positions or Pins (Grid):6 (1 x 6)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Tin
- Contact Finish Thickness - Mating:150.0µin (3.81µm)
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Closed Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin
- Contact Finish Thickness - Post:200.0µin (5.08µm)
- Contact Material - Post:Brass
- Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
- Operating Temperature:-