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Technical Details

  • Series:SIP1x
  • Package:Bulk
  • Part Status:Obsolete
  • Type:SIP
  • Number of Positions or Pins (Grid):15 (1 x 15)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:10.0µin (0.25µm)
  • Contact Material - Mating:Beryllium Copper

 

  • Mounting Type:Through Hole
  • Features:Closed Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Tin
  • Contact Finish Thickness - Post:200.0µin (5.08µm)
  • Contact Material - Post:Brass
  • Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
  • Operating Temperature:-

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