2-382713-1
TE Connectivity AMP Connectors
- Lifecycle status Active
- RoHS RoHS Compliant
- DescriptionCONN IC DIP SOCKET 18POS TIN
- CategorySockets for ICs, Transistors
- Datasheet 2-382713-1 Datasheet
-
ECAD Model
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In Stock: 156
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Technical Details
- Series:Diplomate DL
- Package:Box
- Part Status:Active
- Type:DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid):18 (2 x 9)
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Tin
- Contact Finish Thickness - Mating:-
- Contact Material - Mating:Beryllium Copper
- Mounting Type:Through Hole
- Features:Open Frame
- Termination:Solder
- Pitch - Post:0.100" (2.54mm)
- Contact Finish - Post:Tin
- Contact Finish Thickness - Post:-
- Contact Material - Post:Beryllium Copper
- Housing Material:Thermoplastic, Glass Filled
- Operating Temperature:-55°C ~ 105°C