IC-316-SGT

Samtec, Inc.
In Stock: 115

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Technical Details

  • Series:IC
  • Package:Bulk
  • Part Status:Obsolete
  • Type:DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid):16 (2 x 8)
  • Pitch - Mating:0.100" (2.54mm)
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:30.0µin (0.76µm)
  • Contact Material - Mating:Beryllium Copper

 

  • Mounting Type:Through Hole
  • Features:Open Frame
  • Termination:Solder
  • Pitch - Post:0.100" (2.54mm)
  • Contact Finish - Post:Gold
  • Contact Finish Thickness - Post:10.0µin (0.25µm)
  • Contact Material - Post:Phosphor Bronze
  • Housing Material:Polyester, Glass Filled
  • Operating Temperature:-55°C ~ 125°C

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