UPD70F3747GB-GAH-AX

Renesas Electronics America
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Technical Details

  • Series:V850ES/Hx3
  • Package:Tray
  • Part Status:Active
  • Core Processor:V850ES
  • Core Size:32-Bit
  • Speed:32MHz
  • Connectivity:CSI, I²C, UART/USART
  • Peripherals:DMA, LVD, PWM, WDT
  • Number of I/O:51
  • Program Memory Size:128KB (128K x 8)

 

  • Program Memory Type:FLASH
  • EEPROM Size:-
  • RAM Size:8K x 8
  • Voltage - Supply (Vcc/Vdd):3.7V ~ 5.5V
  • Data Converters:A/D 10x10b
  • Oscillator Type:Internal
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-LQFP
  • Supplier Device Package:-

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